Due to the high speed of the IC and the LSI semiconductor itself, and in order to achieve the purpose of normal operation of the High Density Printed Circuit Board Design, the technical competition is becoming more and more fierce and it is also become more important for the Integration of Analog & Digital Technology.…
Generally, engineer must consider Clone Printed Circuit Board Conductor Lost Effect, since the substrate pattern cross-sectional area is 100 μm, the DC resistance is about 172 Ω/m, and the MCM pattern cross-sectional area using the miniaturized wire is about 30 μm, but the DC impedance is as high as 573 Ω/m, assuming that the impedance…
Mosfet component can shortens the circuitry delay on the board, which is the basic condition for cloning a high-speed transmission PCB board, and the shorter the length of the line, the better. Reducing the wire delay time usually adopts two methods: wire material length. The delay time per unit length is proportional to the square…
The biggest problem in Reverse Engineering High Speed Printed Circuit Board with operating frequencies exceeding 1 GHz is the loss of induced electricity. The general circuit only needs to consider the conductor loss, but the induced loss near 1 GHz is dominant. Such a result is quite unexpected for beginners. The main reason is that…
MOS shortens the circuitry delay of the board, which is the basic condition to Clone PCB Board Conductor Loss, and the shorter the length of the wires, the better. Reducing the wire delay time usually adopts two methods: wire material length and length. The delay time per unit length is proportional to the square root…
The biggest problem in reverse engineering high-speed circuit board with operating frequencies exceeding 1 GHz is the loss of induced electricity. The general circuit only needs to consider the conductor loss, but the induced loss near 1 GHz is dominant. Such a result is quite unexpected for beginners. The main reason is that the importance…
In terms of environment, the Pad Geometry Design in PCB Reverse Engineering may be different and it is based on the type of welding used to mount the electronic parts. When it becomes possible, the pad shape should be defined in a way that is transparent to the mounting process used. Whether the parts are…
Most people think the BALL GRID ARRAY package with mass chip scale as a feasible solution for portable electronic product to break the space limitation for High Density PCB Board Design. And it will simultaneously satisfy both the requirement for more complicate functions and performance. However the design high density circuit board of portable electronic…
PCB Board Schematic diagram is a kind of electrical drawing which help to present the electrical/electronic operational functions and principle, so it will also be called as electrical schematic diagram. Since this kind of drawings directly present the electronic/electrical structure and operation principle, so it will be applied on the design and analyze the circuitry…
PCB Board is important component in the electronic product, is the carrier of electronic components and electricity connection provider. Traditional PCB Board use printed etching and solder resistance method to produce the circuitry pattern which comes its name. due to the increasing minimization and finest, most of the PCB Boards are applying the adhesive etching…