Daily Archives: February 21, 2019

Component Thermal Operation reliability Analysis

The maximum junction temperature that any heat source component can withstand is limited. as a result of that, it has become extremely important for Component Thermal Operation reliability Analysis. This maximum junction temperature can be found in the datasheet given by the manufacturer. If the junction temperature of the actual operation of the heat source…

Card Terminal PCB Board Thermal Design

There are many conventional methods for PCB Board Thermal Design, such as: hot spot dispersion; the device with the largest heat generation is placed at the optimal position for heat dissipation; the high heat dissipation device should minimize the thermal resistance between them when connected to the substrate; each layer of the PCB It is…