Since the resolution capability of the traditional exposure machine is about 50μm, for the production of high level multilery printed circuit boards, a laser direct imaging machine (LDI) can be introduced to improve the image resolution capability, and the resolution capability can reach about 20μm. The multilayer PCB board alignment controlling accuracy of traditional exposure…
The main factors considered in the Cloning Multilayer PCB Board Laminated Structure are the heat resistance of the material, the withstand voltage, the amount of glue filling and the thickness of the dielectric layer, etc. The following main principles should be followed. (1) Prepreg and core board manufacturers must be consistent. In order to ensure…
Multilayer Printed Circuit Board Manufacturing main production difficulties compared with the characteristics of conventional circuit boards, high-level electronic multilayer circuit boards have the characteristics of thicker boards, more layers, denser lines and vias, larger unit size, and thinner dielectric layers. Impedance design control and reliability requirements are more stringent. 1.1 Difficulties in inter-layer alignment Due…
Electronic Multilayer PCB Boards are generally defined as high-level multi-layer circuit boards with 10 layers to 20 layers or more, which are more difficult to process than traditional multi-layer circuit boards, and have high quality and reliability requirements. They are mainly used in communication equipment, high-end servers, and medical electronics, aviation, industrial control, military and…
When the Infrared Jammer PCB Board size is too large, the printed wiring lines will be long, the impedance will increase, the anti-noise capability will decrease, and the cost will also increase; if the PCB size is too small, the heat dissipation will be poor, and the adjacent lines will be easily interfered. After determining…