PCB Reverse Engineering technology is used to reversely analyze the printed circuit board, and to acquire the Layout Drawing, Gerber File, Bill of materials (BOM), Schematic diagram and designators drawing are restored in the aspect ratio of 1:1, and then these technical documents and production files are used for PCB board remanufacturing, component soldering, flying probe testing, circuit board debugging, and complete replication of the original circuit board.
In this article we will introduce the Reverse Engineering PCB Board Background from defence industry: Defense contractors who supply systems, equipment and spare parts during the initial production phase of a weapon system acquisition in which they have performed in the development, frequently become the “sole-source” for follow-on procurement. The cost of items procured under…
The “ground plane” layer obtained from High Frequency PCB Board Cloning is often advocated as the best return for power and signal currents, while providing a reference node for converters, references, and other subcircuits. However, even extensive use of a ground plane does not ensure a high quality ground reference for an ac circuit. The simple…
As if dealing with mixed-signal ICs with AGND and DGNDs wasn’t enough in the process of Printed Circuit Board Reverse Engineering, DSPs such as the ADSP-21160 SHARC with internal phase-locked-loops (PLLs) raise issues with respect to proper grounding. The ADSP-21160 PLL allows the internal core clock (determines the instruction cycle time) to operate at a…
An alternative grounding method for a mixed-signal device with high levels of digital currents in Multilayer Board Reverse is shown in below Figure. The AGND of the mixed signal device is connected to the analog ground plane, and the DGND of the device is connected to the digital ground plane. The digital currents…
Below Figure summarizes the approach previously described for Grounding Mixed-Signal Devices with Low DC in Multilayer PCB Card Cloning. The analog ground plane is not corrupted because the small digital transient currents flow in the small loop between VD, the decoupling capacitor, and DGND (shown as a heavy line). The mixed signal device…
Most ADC, DAC, and other mixed-signal device data sheets discuss grounding relative to Cooling System PCB Board Reverse Engineering, usually the manufacturer’s own evaluation board. This has been a source of confusion when trying to apply these principles to multicard or multi-ADC/DAC systems. The recommendation is usually to split the PCB ground plane into an…
Ideally, the crystal oscillator used on Sampling Clock Distribution from ON Board Diagnotis PCB Cloning should be referenced to the analog ground plane in a split-ground system. However, this is not always possible because of system constraints. In many cases, the sampling clock must be derived from a higher frequency multipurpose system clock which is…
In a high performance sampled data system a low phase noise crystal oscillator should be used to generate the ADC Sampling Clock in Lambda Control Board Reverse Eng because sampling clock jitter modulates the analog input/output signal and raises the noise and distortion floor. The sampling clock generator should be isolated from noisy digital circuits and…
Digital Ground Plane of PCM PC Board Cloning The buffer register and other digital circuits should be grounded and decoupled to the Digital Ground Plane of PCM PC Board Cloning. Notice that any noise between the analog and digital ground plane reduces the noise margin at the converter digital interface. Since digital noise immunity is…
ADC Digital Output in ECU Board Reverse Engineering ADC Digital Output in ECU Board Reverse Engineering is important for the whole design process, as a result of that, it is always a good idea to place a buffer register adjacent to the converter to isolate the converter’s digital lines from noise on the data bus.…