PCB Reverse Engineering technology is used to reversely analyze the printed circuit board, and to acquire the Layout Drawing, Gerber File, Bill of materials (BOM), Schematic diagram and designators drawing are restored in the aspect ratio of 1:1, and then these technical documents and production files are used for PCB board remanufacturing, component soldering, flying probe testing, circuit board debugging, and complete replication of the original circuit board.
Fuel Cut Defencer PCB Board Reverse Engineeirng Related to the star ground system discussed earlier is the use of a ground plane on Fuel Cut Defencer PCB Board Reverse Engineeirng. To implement a ground plane, one side of a double-sided PCB (or one layer of a multilayer one) is made of continuous copper and used…
Separate AGND & DGND Through Reverse Engineering Circuit Board Note also that many ADCs and DACs have separate analog ground (AGND) and digital ground (DGND) pins through Reverse Engineering Circuit Board. On the device data sheets, users are often advised to connect these pins together at the package. This seems to conflict with the advice to connect…
Restore PCB Board to Separate Analog and Digital Grounds As a fact of life, digital circuitry is noisy. Saturating logic, such as TTL and CMOS, draws large, fast current spikes from its supply during switching. However, logic stages, with hundreds of millivolts (or more) of noise immunity, usually have little need for high levels of…
Star Ground in PC Board Reverse Engineering The Star Ground in PC Board Reverse Engineering philosophy builds on the theory that there is one single ground point in a circuit to which all voltages are referred. This is known as the star ground point. It can be better understood by a visual analogy—the multiple conductors…
Signal Processing in Circuit Board Cloning Today’s signal processing in Circuit board cloning system generally require mixed-signal devices such as analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) as well as fast digital signal processors (DSPs). Requirements for processing analog signals having wide dynamic ranges increase the importance of high performance ADCs and DACs. …
Successful Grounding in PCB Card Reverse Engineering In below article we discuss PCB grounding. This is undoubtedly one of the most difficult subjects in PCB Card reverse engineering. While the basic concepts are relatively simple, implementation is very involved. For linear systems the ground is the reference against which we base our signal. Unfortunately, it…
LVDS Output on Multi-Function Recorder PCB Reverse Engineering LVDS Output on Multi-Function Recorder PCB Reverse Engineering for high performance ADCs should be treated differently than standard LVDS outputs used in digital logic. While standard LVDS can drive 1 meter to 10 meters in high speed digital applications (dependent on data rate), it is not recommended…
LVDS Logic in Switch Panel Circuit Board Reverse Engineering Recently, LVDS logic in Switch panel circuit board reverse engineering (low-voltage-differential-signaling) has attained widespread popularity because of similar characteristics, but with lower amplitudes and lower power dissipation than ECL. The defining LVDS specification can be found in the References. The LVDS logic swing is typically 350…
Source Termination in Trim Module PCB Card Cloning How Source Terminations in Trim Module PCB Card Cloning can be used in bidirectional link port transmissions between SHARC DSPs. The output impedance of the SHARC driver is approximately 17, and therefore a 33 series resistor is required on each end of the transmission line for proper…
High Speed DSP Interconnection on PCB Copy Below Figure shows a situation where several high speed DSPs must connect to a single point on PCB Copy, as would be the case when using read or write strobes bidirectionally connected from several DSPs. Small damping resistors shown in Figure A can minimize ringing provided the length…