Before cloning multilayer PCB board, the designer needs to first determine the multilayer PCB board structure to be used according to the size of the circuitry pattern, the dimension of the circuit board, and the requirements of electromagnetic compatibility (EMC), that is, whether the process is to reverse engineering a 4 layers, a 6 layers, or More layers of circuit boards. After determining the number of layers, determine where the inner layers are placed and how different signals are distributed across the layers. This is the choice of multilayer PCB board laminate structure. The laminated structure is an important factor affecting the EMC performance of a multilayer PCB Board and an important means to suppress electromagnetic interference. This section describes the related content of the multilayer PCB board laminate structure cloning principle.
First of all we need to consider the layer count and laminate principle, since it will determine the laminated structure of a multilayer PCB requires consideration of many factors. In terms of circuitry layout, the more layers, the more convenient for PCB board layout, but the cost and difficulty of PCB board manufacturing will also increase. For the manufacturer, the symmetry of the laminated structure is the focus of PCB board manufacturing, so the choice of the number of layers needs to consider all aspects of the need to achieve the best balance.
For experienced designers, after the pre-layout of components is completed, the PCB board circuitry layout has become the bottlenect which will be analyzed. Combine other EDA tools to analyze the wiring density of the board; then combine the number and type of signal lines such as differential lines and sensitive signal lines with special wiring requirements to determine the number of layers of the signal layer; then according to the type of power supply, isolation and anti-interference The requirements to determine the number of inner layers. In this way, the number of layers of the entire board is basically determined.
