The goal of Redesign PCB Board Layout For Better EMC Performance process is: “Each process has a verification, and the quality problem is controlled in the earliest stage in time”. Three design control points are added for this:
(1) circuit simulation before wiring;
(2) Signal integrity analysis, electromagnetic compatibility analysis, power integrity analysis, thermal radiation analysis, reliability calculation and prediction after Printed circuit Board redesigning;
(3) EMI measurement, thermal radiation measurement when power is applied after pcb board manufacturing.
It can be seen that the traditional PCB design method has been unable to adapt to the design of modern electronic systems. In the design process of modern electronic products, due to the addition of some simulation analysis, the electromagnetic compatibility performance and PCB board quality of the product are greatly improved, and the electromagnetic compatibility standard of the product is easily satisfied.
Electromagnetic compatibility pre-simulation analysis of PCBs using software, which can be roughly estimated at the design stage of the product. Taking into account the electromagnetic compatibility of the PCB and understanding the distribution trend of the PCB on the field, this has greatly helped the reasonable layout from Redesign PCB Board Layout. Therefore, it can greatly improve product performance, save costs, shorten development time, speed up the pace of products entering the market, and strive for valuable time and economic benefits for occupying large market share.
