Reverse Engineering Circuit Board Material Analysis Reverse Engineering Circuit Board Material Analysis Objective The material analysis, including chemical and metallurgical analysis, should be performed to determine the composition, surface treatments, finishes, hardness, and heat treatments pertinent to each piece-part/component. since circuit board can be made by various material from Fiber resin with glass cloth, the…
In many cases, manufacturing methods, such as punched parts, injection molded, or investment cast parts, indicate Mechanical Parts Dimensional Analysis in PC Board Reverse Engineering. (1) Normally, items that are sheared or punched do not require a good surface finish on the sheared edge. However, in some cases, the manufacturer will intentionally punch a hole…
PCB Board Reverse Engineering Dimensional Analysis objective refers to the electronic/mechanical components on the Printed circuit board, the dimensions define the size and shape of the part and locate all part features. Tolerances describe the dimensional limits to facilitate manufacturing while ensuring proper fit and function of parts or assemblies. A dimensional analysis should be…
Printed Circuit Board Reverse Engineering Analysis First of all, Printed Circuit Board Reverse Engineering Analysis Objective Printed Circuit Board Reverse Engineering Analysis should be performed to develop the missing data required for a technical data package. In those cases where the existing technical documentation is either incomplete or unavailable which is quite normal for those…
PCB Board reverse engineering management plan may be developed at the beginning of the process. This plan may not be complete, however, until all the PCB layout drawing, list of component and schematic diagram are reviewed. This management plan may include in-process reviews and possible economical cut-off points. A tasking plan should be developed upon…
Part Identification in PCB Reverse Engineering After disassembly each piece-part/component in PCB reverse engineering process should be researched to identify existing NSNs, commercially available hardware, MIL-STD parts, and non-standard parts. Economic analysis. An economic analysis should be performed on all sole-source and non-standard piece-parts/components to determine the cost-effectiveness of reverse engineering PCB’s piece-part/component. A limited…
When Disassembly PCB Board Reverse Engineering Target, notes should be recorded for possible assembly procedures to be included in the Technical data package. As they are disassembled, a list of all piece-parts/components should be created, including quantities and special part markings which may indicate that the part is either commercially available or a military specifications…
Post-PC Board shipment inspection To preclude the replication of defects, the PC Board Reverse Engineering Initial Inspection for possible damage in shipment. sometimes the PC board sent from customers may have the faulty or malfunction problem such as the burn out capacitor, incapable integrated circuit or mis-match oscillators, unshaped terminal block or pin header. we…
PCB Reverse Engineering Cost-Estimate & Schedule previously generated should be reviewed. Most of these estimates were based on a best guess, at the time, without benefit of hardware availability. 1 Development The PCB Reverse Engineering Cost-Estimate and Schedule should be based on the complexity of the PC board and the number of piece-parts/components involved. The…
Printed Circuit Board Reverse Engineering Test includes three phases from initial inspection, test plan objective to worse-case analysis: First consideration is Initial inspection The test requirements to be determined include initial inspection and testing of the hardware provided for printed circuit board reversing engineering, and for inspection and acceptance of the prototype to be…