The Reverse Engineering PCB Data Evaluation sub-phase should take below consideration into account: All required PCB manufacturing materials specified in the bill of materials, notes, military or process specifications, or elsewhere within the applicable data? (Any deletions or omissions should be specified.) Are all parts (electronic or mechnically) completely dimensioned or otherwise fully defined? (Any…
The PCB Board reverse engineering technical drawing package for candidate may include restricted or inadequate end-item documentation and drawings which must be developed through engineering analyses of existing hardware. A competitive Technical drawing package should include all the documentation necessary to describe the PCB Board design configuration, manufacturing, quality assurance, testing, and packaging requirements. The…
The Reverse Engineering PCB Card Primary Objectiveis the development of unrestricted technical data such as the layout drawing, gerber file, list of component and schematic diagram, adequate for competitive procurement, through engineering evaluations of existing PCB Card. The nominal PCB Card reverse engineering process is depicted in below Figure. Detailed procedures are described in Subsections…
All documentation include layout drawing, Gerber file, List of component and Schematic diagram delivered for reverse engineering circuit board purposes must be carefully screened by the Tasking Agency and tasking executor prior to delivery, to ensure that no restricted or proprietary data is included. Any additional data subsequently requested by circuit board reverse engineering personnel…
One method of controlling the high costs of replenishment spares is by reverse engineering PC Board. Reverse engineering PC Board is the process of duplicating a PC Board, functionally and dimensionally, by physically examining and measuring existing parts to develop the technical data (physical and material characteristics) required for competitive procurement. The reverse engineering PC…
In this article we will introduce the Reverse Engineering PCB Board Background from defence industry: Defense contractors who supply systems, equipment and spare parts during the initial production phase of a weapon system acquisition in which they have performed in the development, frequently become the “sole-source” for follow-on procurement. The cost of items procured under…
The “ground plane” layer obtained from High Frequency PCB Board Cloning is often advocated as the best return for power and signal currents, while providing a reference node for converters, references, and other subcircuits. However, even extensive use of a ground plane does not ensure a high quality ground reference for an ac circuit. The simple…
As if dealing with mixed-signal ICs with AGND and DGNDs wasn’t enough in the process of Printed Circuit Board Reverse Engineering, DSPs such as the ADSP-21160 SHARC with internal phase-locked-loops (PLLs) raise issues with respect to proper grounding. The ADSP-21160 PLL allows the internal core clock (determines the instruction cycle time) to operate at a…
An alternative grounding method for a mixed-signal device with high levels of digital currents in Multilayer Board Reverse is shown in below Figure. The AGND of the mixed signal device is connected to the analog ground plane, and the DGND of the device is connected to the digital ground plane. The digital currents…
Below Figure summarizes the approach previously described for Grounding Mixed-Signal Devices with Low DC in Multilayer PCB Card Cloning. The analog ground plane is not corrupted because the small digital transient currents flow in the small loop between VD, the decoupling capacitor, and DGND (shown as a heavy line). The mixed signal device…