Most ADC, DAC, and other mixed-signal device data sheets discuss grounding relative to Cooling System PCB Board Reverse Engineering, usually the manufacturer’s own evaluation board. This has been a source of confusion when trying to apply these principles to multicard or multi-ADC/DAC systems. The recommendation is usually to split the PCB ground plane into an…
Ideally, the crystal oscillator used on Sampling Clock Distribution from ON Board Diagnotis PCB Cloning should be referenced to the analog ground plane in a split-ground system. However, this is not always possible because of system constraints. In many cases, the sampling clock must be derived from a higher frequency multipurpose system clock which is…
In a high performance sampled data system a low phase noise crystal oscillator should be used to generate the ADC Sampling Clock in Lambda Control Board Reverse Eng because sampling clock jitter modulates the analog input/output signal and raises the noise and distortion floor. The sampling clock generator should be isolated from noisy digital circuits and…
Digital Ground Plane of PCM PC Board Cloning The buffer register and other digital circuits should be grounded and decoupled to the Digital Ground Plane of PCM PC Board Cloning. Notice that any noise between the analog and digital ground plane reduces the noise margin at the converter digital interface. Since digital noise immunity is…
ADC Digital Output in ECU Board Reverse Engineering ADC Digital Output in ECU Board Reverse Engineering is important for the whole design process, as a result of that, it is always a good idea to place a buffer register adjacent to the converter to isolate the converter’s digital lines from noise on the data bus.…
Power Tuning Module PCB Board Redesign It is true that Power Tuning Module PCB Board Redesign may inject a small amount of digital noise onto the analog ground plane. These currents should be quite small, and can be minimized by ensuring that the converter output does not drive a large fanout (they normally can’t, by…
Analog Ground Plane Design in Cloning PCB Sensitive analog components such as amplifiers and voltage references are always referenced and decoupled to the Analog Ground Plane Design in Cloning PCB. The ADCs and DACs (and other mixed-signal ICs) with low digital currents should generally be treated as analog components and also grounded and decoupled to the analog…
Ground Plane Design in Circuit Board Reverse Engineering Ground planes also allow the transmission of high speed digital or analog signals using transmission line techniques (microstrip or stripline) where controlled impedances are required, as a result of that, Ground Plane Design must be taken into consideration of Circuit Board Reverse Engineering. The use of “buss wire”…
Soldering Integrated Circuit Ground Pin in PCB Reverse Engineering All soldering integrated circuit ground pin in PCB Reverse Engineering should be soldered directly to the low impedance ground plane to minimize series inductance and resistance. The use of traditional IC sockets is not recommended with high speed devices. The extra inductance and capacitance of even…
Shift Light Module Card Cloning Ground planes on Shift Light Module Card Cloning also allow the transmission of high speed digital or analog signals using transmission line techniques (microstrip or stripline) where controlled impedances are required. The use of “buss wire” is totally unacceptable as a ground because of its impedance at the equivalent frequency…